Product and technology at international exhibition
HNS Hi-tech announced on the 26th that it has introduced its own semiconductor packaging materials at an international exhibition.
HNS Hi-tech unveiled its electrode matching film (PATTERN MATCHING FILM) technology and products at the "2026 World Display Fair" (SID 2026) held at the LA Convention Center in the U.S. for three days from the 5th to the 7th.
PMF is a material technology that arranges conductive particles according to the shape of electrodes based on HNS Hi-tech's flagship anisotropic conductive film (ACF) technology. PMF can be applied not only to high-resolution display products but also to semiconductor packaging. ACF is a high-tech material that precisely connects fine electronic components such as various displays and mobile phone camera modules.
"PMF can replace metal bumps that electrically connect chips and chips or substrates among existing semiconductor materials," a HNS Hi-tech official said.
In the exhibition, solder non-conductive film (NCF) used in semiconductor packaging, Hyper-even distribution film (HDF), and build-up film, a semiconductor ultra-precise substrate material, were also unveiled.
HNS Hi-tech invested 23.4 billion won in R&D for five years from 2021 to 2025. It plans to continue investing in R&D in the future.
Last year, HNS Hi-tech recorded 81.9 billion won in sales. As the performance of the materials business sector such as ACF and the electronics business sector such as crystal oscillators is growing, we are aiming for the largest performance since its establishment this year.
Kim Jung-hee, CEO of HNS Hi-tech, said, "We will work together to establish a collaboration system related to mass production through joint testing with global customers and to visually raise performance based on this."
