Otech Carrier announced on the 10th that Kang Sung-hee, chairman of Otech Carrier, recently visited Carrier's Asia-Pacific regional headquarters in Singapore and held a strategic meeting with global carrier presidents and key positions.
An Otech Carrier official explained, "The meeting is designed to maximize global cooperation in next-generation HVAC (heating, ventilation, and cooling) businesses, including rapidly growing artificial intelligence (AI) data center cooling solutions, and secure future growth engines."
At the meeting, Otech Carrier and Global Carrier shared their business strategies to respond to changes in the global HVAC market and customer demand. Focusing on AI data center cooling solutions, they exchanged opinions on technical cooperation and business expansion strategies such as high-efficiency heat pumps and commercial and industrial air conditioning products including chiller for semiconductor plants.
The two companies decided to continue to expand their product portfolio and further strengthen their cooperation system to proactively respond to the changing market environment. Through this, it plans to continue to introduce differentiated air conditioning solutions that meet customer needs and further increase its competitiveness in the domestic market.
Kang Sung-hee, chairman of Otech Carrier, said, "We will actively expand next-generation businesses such as AI data center cooling solutions and heat pumps to provide higher value to customers," adding, "We will continue to strengthen product competitiveness and further solidify the foundation for cooperation in future growth projects based on close cooperation with global key management."
